Search Results
Showing results 1 to 20 of 59.
Chapter
PbS CQD device performance and modeling
March 01, 2018
Chapter
Flexible Hybrid Electronics Fabricated with High-Performance COTS ICs using RTI CircuitFilm(TM) Technology
July 31, 2017
Chapter
Performance evaluation and modeling of a Conformal Filter (CF) based real-time standoff hazardous material detection sensor
May 03, 2017
Chapter
Wafer-to-wafer bonding for hermetic and vacuum packaging of smart sensors
May 01, 2017
Chapter
RTI CircuitFilm(TM) Technology for Implementing High-Performance COTS ICs in Flexible Hybrid Electronics
March 01, 2017
Chapter
Wafer-Level Vacuum Packaging of Microbolometer-Based Infrared Imagers
October 24, 2016
Chapter
Towards low-cost infrared imagers: how to leverage Si IC ecosystem
October 21, 2016
Chapter
Highly Integrated Thermoelectric Coolers
June 01, 2016
Chapter
Colloidal quantum dot Vis-SWIR imaging: demonstration of a focal plane array and camera prototype
August 01, 2015
Chapter
Advanced 3D mixed-signal processor for infrared focal plane arrays: Fabrication and test
June 01, 2015
Chapter
Advanced 3D mixed-signal processor for infrared focal plane arrays: Fabrication and test
December 01, 2014
Chapter
High density interconnect bonding of heterogeneous materials using non-collapsible microbumps at 10 µm pitch
October 01, 2014
Chapter
Low-cost SWIR sensors: Advancing the performance of ROIC-integrated colloidal quantum dot photodiode arrays
June 01, 2014
Chapter
Process integration, improvements, and testing of Si interposers for embedded computing applications
May 27, 2014
Chapter
Demonstration of low cost TSV fabrication in thick silicon wafers
May 01, 2014
Chapter
High density interconnect bonding of heterogeneous materials using non-collapsible microbumps at 10 micron pitch
October 02, 2013
Chapter
Low Cost Uncooled VOx Infrared Camera Development
October 01, 2013
Chapter
Fabrication and testing of thin silicon interposers with multilevel frontside and backside metallization and Cu-filled TSVs
May 01, 2013
Chapter
Characterization and modeling of copper TSVs for silicon interposers
May 01, 2013
Chapter
High-density 3-D IC integration technology for mixed-signal microsystems
March 11, 2013