• Presentation

Characterization and modeling of copper TSVs for silicon interposers

Citation

Malta, D., Gregory, C., Lueck, M., Lannon, J., Lewis, J., Temple, D., ... Petzold, M. (2013, May). Characterization and modeling of copper TSVs for silicon interposers. Presented at 63rd Electronic Components and Technology Conference (ECTC 2013), Las Vegas, NV, May 28-31, .

Abstract