Wafer-Level Vacuum Packaging of Microbolometer-Based Infrared Imagers
Hilton, Jr., J. A., Temple, D., Lannon, J., Schimert, T., Skidmore, G., Gooch, R., Trujillo, C., Miskimins, S., & Li, C. (2016). Wafer-Level Vacuum Packaging of Microbolometer-Based Infrared Imagers. In English
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