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Wafer-Level Vacuum Packaging of Microbolometer-Based Infrared Imagers

Hilton, Jr., J. A., Temple, D., Lannon, J., Schimert, T., Skidmore, G., Gooch, R., Trujillo, C., Miskimins, S., & Li, C. (2016). Wafer-Level Vacuum Packaging of Microbolometer-Based Infrared Imagers. In English

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Dorota Temple

Recent Publications

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Developing capacity in identifying cost-effective interventions to prevent and reduce obesity in China
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US consumer and healthcare professional preferences for combination COVID-19 and influenza vaccines
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Comparing youth-friendly clinics to the standard of care for adolescent girls and young women in Malawi: A qualitative analysis
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Patient-reported outcome improvements following scalp hair regrowth among patients with Alopecia Areata: analysis of the ALLEGRO-2b/3 trial