Search Results
Showing results 21 to 40 of 173.
Article
Wafer-level vacuum packaging of smart sensors
November 01, 2016
Chapter
Wafer-Level Vacuum Packaging of Microbolometer-Based Infrared Imagers
October 24, 2016
Chapter
Towards low-cost infrared imagers: how to leverage Si IC ecosystem
October 21, 2016
Chapter
Highly Integrated Thermoelectric Coolers
June 01, 2016
Patent
Electronic Devices Utilizing Contact Pads with Protrusions and Methods for Fabrication
February 09, 2016
Chapter
Colloidal quantum dot Vis-SWIR imaging: demonstration of a focal plane array and camera prototype
August 01, 2015
Chapter
Advanced 3D mixed-signal processor for infrared focal plane arrays: Fabrication and test
June 01, 2015
Patent
Three dimensional interconnect structure and method thereof
March 10, 2015
Article
Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10 µm for infrared focal plane array applications
March 01, 2015
Article
Advances in three-dimensional integration technologies in support
February 01, 2015
Article
Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10um for infrared focal plane array applications
January 01, 2015
Chapter
Advanced 3D mixed-signal processor for infrared focal plane arrays: Fabrication and test
December 01, 2014
Patent
Faraday cup array integrated with a readout IC and method for manufacture thereof
October 21, 2014
Chapter
High density interconnect bonding of heterogeneous materials using non-collapsible microbumps at 10 µm pitch
October 01, 2014
Chapter
Low-cost SWIR sensors: Advancing the performance of ROIC-integrated colloidal quantum dot photodiode arrays
June 01, 2014
Chapter
Process integration, improvements, and testing of Si interposers for embedded computing applications
May 27, 2014
Chapter
Demonstration of low cost TSV fabrication in thick silicon wafers
May 01, 2014
Article
Enabling more capability within smaller pixels: advanced wafer-level process technologies for integration of focal plane arrays with readout electronics (invited paper)
May 01, 2014
Article
Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization
January 01, 2014
Chapter
High density interconnect bonding of heterogeneous materials using non-collapsible microbumps at 10 micron pitch
October 02, 2013