An electronic device includes a substrate including a front side, a back side, a thickness between the front side and back side, one or more front-side vias extending from the front side into a part of the thickness, and an interconnect via extending from the back side toward the front side; a contact pad on the front side and including one or more protrusions extending through corresponding front-side vias and into the interconnect via; and an interconnect extending through the interconnect via and into contact with the protrusion(s).
Electronic Devices Utilizing Contact Pads with Protrusions and Methods for Fabrication
Temple, D., Vick, E., & Cunningham, G. (2016). IPC No. U.S. Electronic Devices Utilizing Contact Pads with Protrusions and Methods for Fabrication. (U.S. Patent No. 9257335).