Search Results
Showing results 41 to 60 of 173.
Chapter
Low Cost Uncooled VOx Infrared Camera Development
October 01, 2013
Chapter
Fabrication and testing of thin silicon interposers with multilevel frontside and backside metallization and Cu-filled TSVs
May 01, 2013
Chapter
Characterization and modeling of copper TSVs for silicon interposers
May 01, 2013
Chapter
High-density 3-D IC integration technology for mixed-signal microsystems
March 11, 2013
Chapter
High Density 3-D Integration Technology for Mixed-Signal Microsystems
March 01, 2013
Patent
Die bonding utilizing a patterned adhesion layer
January 29, 2013
Article
High Performance Solenoidal Radio Frequency Transformers on High Resistivity Silicon Substrates for 3D Integrated Circuits
July 01, 2012
Article
High Density Large Area Array Interconnects Formed by Low Temperature Cu/Sn-Cu Bonding for 3-D Integrated Circuits
July 01, 2012
Article
High-performance solenoidal RF transformers on high-resistivity silicon substrates for 3D integrated circuits
July 01, 2012
Chapter
Process integration and testing of TSV Si interposers for 3D integration applications
May 30, 2012
Chapter
High density metal-metal interconnect bonding with pre-applied fluxing underfill
May 30, 2012
Chapter
Low temperature metal and polymer bonding for advanced infrared imaging sensors
May 22, 2012
Chapter
High Density Metal-Metal Interconnect Bonding with Pre-Applied Fluxing Underfill
May 01, 2012
Chapter
Process Integration and Testing of TSV Si Interposers for 3D Integration Applications
May 01, 2012
Chapter
Low Temperature Metal and Polymer Bonding for Advanced Infrared Imaging Sensors (Invited Paper)
May 01, 2012
Chapter
Solution-processed colloidal quantum dot photodiodes for low-cost SWIR imaging
May 01, 2012
Article
Planar PbS quantum dot/C-60 heterojunction photovoltaic devices with 5.2% power conversion efficiency
April 01, 2012
Article
High-density large-area-array interconnects formed by low-temperature Cu/Sn–Cu bonding for three-dimensional integrated circuits
April 01, 2012
Chapter
Temporary wafer bonding materials and processes
March 05, 2012
Chapter
Temporary Wafer Bonding Materials and Processes
March 01, 2012