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EXPERT

Dorota Temple

Showing results 41 to 60 of 189.

Chapter

Process Integration and Testing of TSV Si Interposers for 3D Integration Applications

May 01, 2012
Article

Planarization processes and applications - II. B2O3/P2O5 doped GeO2-SiO2 classes

January 01, 1999
Chapter

Vias-last process technology for thick 2.5D Si interposers

January 01, 2012
RTI Press Publication

The view from above: Satellites inform decision-making for food security

August 16, 2019
Article

Scaling law and its universality in the anomalous Hall effect of giant-magnetoresistive Fe/Cr multilayers

March 01, 2006
Article

Silicon field emitter cathodes: Fabrication, performance, and applications

January 01, 1998
Article

Wearable sensor-based detection of influenza in presymptomatic and asymptomatic individuals

April 12, 2023
Article

High Performance Solenoidal Radio Frequency Transformers on High Resistivity Silicon Substrates for 3D Integrated Circuits

July 01, 2012
Article

Planarization processes and applications - I. Undoped GeO2-SiO2 glasses

January 01, 1999
Chapter

Fabrication of silicon field emitter arrays

January 01, 1996
Article

Diffusion of oxygen vacancies in thin EuO films

January 01, 1984
Chapter

3-D integration technology platforms for high performance mixed-signal applications

April 01, 2011
Article

Electrical transport in ferromagnetic semiconductor EuO

January 01, 1985
Patent

Closed-loop cold cathode current regulator

December 10, 2002
Article

Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration

March 01, 2009
Article

Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10um for infrared focal plane array applications

January 01, 2015
Chapter

Processing Techniques for 3-D Integration

October 01, 2001
Article

Measured DC performance of large arrays of silicon field emitters

October 01, 1994
Patent

Methods of raising reflow temperature of glass alloys by thermal treatment in steam, and microelectronic structures formed thereby

August 07, 2001
Article

3-D integration technology for high performance detector arrays

January 01, 2006