• Conference Proceeding

Vias-last process technology for thick 2.5D Si interposers

Citation

Vick, E., Goodwin, S., Cunningham, G., & Temple, D. (2012). Vias-last process technology for thick 2.5D Si interposers. In 2011 IEEE International 3D Systems Integration Conference (3DIC 2011), Osaka, Japan, 31 January - 2 February 2012 (Postponed from October 2011),, pp. 263–266. .

Abstract