RTI uses cookies to offer you the best experience online. By clicking “accept” on this website, you opt in and you agree to the use of cookies. If you would like to know more about how RTI uses cookies and how to manage them please view our Privacy Policy here. You can “opt out” or change your mind by visiting: http://optout.aboutads.info/. Click “accept” to agree.
Effect of Morphology on the Electrical Resistivity of Silver Nanostructure Films
Stewart, I. E., Kim, M. J., & Wiley, B. J. (2017). Effect of Morphology on the Electrical Resistivity of Silver Nanostructure Films. ACS applied materials & interfaces, 9(2), 1870-1876. https://doi.org/10.1021/acsami.6b12289
The relatively high temperatures (>200 degrees C) required to sinter silver nanoparticle inks have limited the development of printed electronic devices on low-cost, heat-sensitive paper and plastic substrates. This article explores the change in morphology and resistivity that occurs upon heating thick films of silver nanowires (of two different lengths; Ag NWs), nanoparticles (Ag NPs), and microflakes (Ag MFs) at temperatures between 70 and 400 degrees C. After heating at 70 degrees C, films of long Ag NWs exhibited a resistivity of 1.8 x 10(-5) Omega cm, 4000 times more conductive than films made from Ag NPs. This result indicates the resistivity of thick films of silver nanostructures is dominated by the contact resistance between particles before sintering. After sintering at 300 degrees C, the resistivity of short Ag NWs, long Ag NWs, and Ag NPs converge to a value of (2-3) x 10(-5) Omega cm, while films of Ag MFs remain similar to 10x less conductive (4.06 x 10(-4) Omega cm). Thus, films of long Ag NW films heated at 70 degrees C are more conductive than Ag NP films sintered at 300 degrees C. Adding 10 wt % nanowires to a film of nanoparticles results in a 400-fold improvement in resistivity.