Dorota Temple

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Modular open-core system for collection and near real-time processing of high-resolution data from wearable sensors

Wearable sensor-based detection of influenza in presymptomatic and asymptomatic individuals

Remote crop mapping at scale: Using satellite imagery and UAV-acquired data as ground truth

Deep neural networks and transfer learning for food crop identification in UAV images

The use of Sentinel-1 and -2 data for monitoring maize production in Rwanda

ROIC for 3 μm pixel pitch colloidal quantum dot detectors

High-efficiency thin-film superlattice thermoelectric cooler modules enabled by low resistivity contacts

Advanced thermal management of high-power quantum cascade laser arrays for infrared countermeasures

Wafer-level vacuum packaging of smart sensors

Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10 µm for infrared focal plane array applications

Advances in three-dimensional integration technologies in support

Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10um for infrared focal plane array applications

Enabling more capability within smaller pixels: advanced wafer-level process technologies for integration of focal plane arrays with readout electronics (invited paper)

Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization

High Performance Solenoidal Radio Frequency Transformers on High Resistivity Silicon Substrates for 3D Integrated Circuits

High Density Large Area Array Interconnects Formed by Low Temperature Cu/Sn-Cu Bonding for 3-D Integrated Circuits

High-performance solenoidal RF transformers on high-resistivity silicon substrates for 3D integrated circuits

Planar PbS quantum dot/C-60 heterojunction photovoltaic devices with 5.2% power conversion efficiency

High-density large-area-array interconnects formed by low-temperature Cu/Sn–Cu bonding for three-dimensional integrated circuits

High density metal-metal interconnect bonding for 3D integration