• Presentation

Bonding for 3-D integration of heterogeneous technologies and materials

Citation

Temple, D., Malta, D., Lannon, J. M., Lueck, M., Huffman, A., Gregory, C. W., ... Skokan, M. R. (2008, October). Bonding for 3-D integration of heterogeneous technologies and materials. Presented at 214th Meeting of the Electrochemical Society and the Prime Pacific Rim Meeting on Electrochemical and Solid-State Science (PRIME 2008), Honolulu, HI, October, .

Abstract