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Search Results

Article

High Performance Solenoidal Radio Frequency Transformers on High Resistivity Silicon Substrates for 3D Integrated Circuits

July 01, 2012
Article

High Density Large Area Array Interconnects Formed by Low Temperature Cu/Sn-Cu Bonding for 3-D Integrated Circuits

July 01, 2012
Article

High-performance solenoidal RF transformers on high-resistivity silicon substrates for 3D integrated circuits

July 01, 2012
Chapter

Process integration and testing of TSV Si interposers for 3D integration applications

May 30, 2012
Chapter

High density metal-metal interconnect bonding with pre-applied fluxing underfill

May 30, 2012
Chapter

Low temperature metal and polymer bonding for advanced infrared imaging sensors

May 22, 2012
Chapter

High Density Metal-Metal Interconnect Bonding with Pre-Applied Fluxing Underfill

May 01, 2012
Chapter

Process Integration and Testing of TSV Si Interposers for 3D Integration Applications

May 01, 2012
Chapter

Low Temperature Metal and Polymer Bonding for Advanced Infrared Imaging Sensors (Invited Paper)

May 01, 2012
Chapter

Solution-processed colloidal quantum dot photodiodes for low-cost SWIR imaging

May 01, 2012
Article

Planar PbS quantum dot/C-60 heterojunction photovoltaic devices with 5.2% power conversion efficiency

April 01, 2012
Article

High-density large-area-array interconnects formed by low-temperature Cu/Sn–Cu bonding for three-dimensional integrated circuits

April 01, 2012
Chapter

Temporary wafer bonding materials and processes

March 05, 2012
Chapter

Temporary Wafer Bonding Materials and Processes

March 01, 2012
Chapter

Vias-last process technology for thick 2.5D Si interposers

January 31, 2012