A flexible electronic assembly includes a flexible current-carrying device, an electrically insulating flexible substrate, and an electronic device embedded in the substrate. The electronic device is mounted face-down on the current-carrying device such that a contact side or component side of the electronic device faces the current-carrying device and is positioned at an interface between the current-carrying device and the substrate. The current-carrying device, substrate, and electronic device are co-planar at the interface. This configuration enables the flexible electronic assembly to have an ultra-thin thickness, for example on the order of micrometers.
Flexible electronic assemblies with embedded electronic devices and methods for their fabrication
Lewis, J. S., Temple, D. S., Vick, E. P., & Klem, E. J. (2019). Flexible electronic assemblies with embedded electronic devices and methods for their fabrication. (U.S. Patent No. 10,264,669). http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=10,264,669.PN.&OS=PN/10,264,669&RS=PN/10,264,669