RTI uses cookies to offer you the best experience online. By clicking “accept” on this website, you opt in and you agree to the use of cookies. If you would like to know more about how RTI uses cookies and how to manage them please view our Privacy Policy here. You can “opt out” or change your mind by visiting: http://optout.aboutads.info/. Click “accept” to agree.
3D and 2.5D packaging assembly with highly silica filled One Step Chip Attach Materials for both thermal compression bonding and mass reflow processes
Duffy, D., Gregory, C., Breach, C., & Huffman, A. (2014). 3D and 2.5D packaging assembly with highly silica filled One Step Chip Attach Materials for both thermal compression bonding and mass reflow processes. In Electronic Components and Technology Conference, 2014 IEEE 64th (pp. 1803 - 1809)
RTI shares its evidence-based research - through peer-reviewed publications and media - to ensure that it is accessible for others to build on, in line with our mission and scientific standards.