RESEARCH TRIANGLE PARK, NC – RTI International’s Microsystem Integration and Packaging group has been acquired by Micross Components, Inc., a privately-held global hi-reliability electronics company. The acquisition brings together RTI’s value-added semiconductor processing techniques with the hi-reliability electronics expertise and comprehensive capabilities of Micross, enabling them to more fully support the needs in the defense and medical electronics industries.
“For some time we have been thinking about the future growth of our electronics and applied physics segment, which provides value-added semiconductor processing services for government and commercial clients,” said RTI International President and CEO Wayne Holden, Ph.D. “This acquisition supports RTI’s long-term strategy and will stimulate faster growth for the microsystems fabrication part of the business, allowing that business to capitalize on the opportunities that exist in the defense and medical electronics industries in the U.S.”
In addition to the Microsystem Integration and Packaging group, Micross has acquired the RTI-owned Advanced Technology Building on Cornwallis Road in Research Triangle Park. Tenants will continue to be able to sublease space from Micross, who will lease the land from TUCASI. RTI will also lease space in the building for the next couple of years.
“Micross is an exceptional organization that complements our Microsystem Integration and Packaging group’s line of research and technology and that will provide these staff members with the resources and opportunities to help ensure their continued success in the future,” said Terri Lomax, executive vice president of Discovery, Science, and Technology at RTI.
Twenty-six RTI staff members will join Micross as part of this acquisition.
Micross – which is headquartered in Orlando and has seven other operations and approximately 400 staff members across the United States and Europe – offers a comprehensive array of hi-reliability electronic solutions for defense, space, medical, industrial and other demanding industries.
The Microsystem Integration and Packaging group provides value-added semiconductor processing services for government and commercial clients. These services include wafer-level packaging, 2.5D/3D packaging and interconnects, and novel sensor and thermal management devices.
Micross Components, Inc. (“Micross”) is a leading one-source, one-solution provider of Bare Die & Wafers, Custom Packaging & Assembly, Component Modification Services, Electrical & Environmental Testing, and Standard Products to manufacturers and users of semiconductor devices. In business for more than 35 years, our comprehensive array of high-reliability capabilities serve the global Defense, Space, Medical, Industrial, and Fabless Semiconductor markets. Micross possesses the sourcing, assembly, test and logistics expertise needed to support an application throughout its entire program cycle.