A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.
Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
Venkatasubramanian, R., Alley, R., Addepalli, P., Reddy, AJ., Siivola, E., O'Quinn, B., ... Colpitts, T. (2011). IPC No. U.S. Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics. (U.S. Patent No. 7997087).