A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.
Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics
Venkatasubramanian, R., Alley, R., Addepalli, P., Reddy, AJ., Siivola, E., O'Quinn, B., Coonley, K., Posthill, J., & Colpitts, T. (2011). IPC No. U.S. Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics. (U.S. Patent No. 7997087). http://patft.uspto.gov/netacgi/nph-Parser?patentnumber=7997087