A reconfigurable high performance computer includes a stack of self-aligning, injection-molded plastic, insulative guide trays. Each insulative guide tray retains at least one semiconductor substrate assembly (SSA) in a lateral dimension with respect to a set of elastomeric connectors. The trays hold the SSAs and the elastomeric connectors such that the elastomeric connectors are sandwiched between, and interconnect, adjacent semiconductor substrates proceeding down the stack. The trays also hold comb-shaped power bus bar assemblies such that power bus bars contact and supply power to circuitry of the SSAs of the stack.
Stackable self-aligning insulative guide tray for holding semiconductor substrates
Conn, RO. (2010). IPC No. U.S. Stackable self-aligning insulative guide tray for holding semiconductor substrates. (U.S. Patent No. 7719844).