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Process Integration and Testing of TSV Si Interposers for 3D Integration Applications
Lannon, J., Hilton, J., Huffman, A., Lueck, M., Vick, E., Goodwin, S., Cunningham, G., Malta, D., Gregory, C., & Temple, D. (2012). Process Integration and Testing of TSV Si Interposers for 3D Integration Applications. In Proc. 62th IEEE Electronic Component and Technology Conference, ECTC 2012 (pp. 268 - 273)
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