• Conference Proceeding

Novel Advanced Interconnects

Citation

LaBennett, R., Bonafede, S., Hoffman, A., & Statler, C. (2003). Novel Advanced Interconnects. In Proceedings of IMAPS 2003, 36th International Symposium on Microelectronics. Sponsored by IMAPS - International Microelectronics Packaging Society: Washington, DC, pp. 282–285. Boston, MA.: .

Abstract