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Metal organic chemical vapor deposition for repairing broken lines in microelectronic packages

Reisman, A., Temple, D. S., & Turlik, I. (1992). Metal organic chemical vapor deposition for repairing broken lines in microelectronic packages. (U.S. Patent No. 5,145,714). http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=1&f=G&l=50&co1=AND&d=PTXT&s1=%22metal+organic%22.TI.&s2=reisman.INNM.&OS=TTL/

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