Low temperature metal and polymer bonding for advanced infrared imaging sensors
Temple, D., Lueck, M., Malta, D., & Vick, E. (2012). Low temperature metal and polymer bonding for advanced infrared imaging sensors. In 2012 3rd IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), The University of Tokyo, Tokyo, Japan, May 22-23, 2012 (pp. 31) https://doi.org/10.1109/LTB-3D.2012.6238044
Low temperature bonding is a critical process module for high density 3-D integration technology as well as wafer-level 3-D packaging. This presentation will review the use of such 3-D integration technologies in advanced infrared imaging sensors. Designs based on 3-D architectures enable infrared cameras that are characterized by high performance, low power, low weight and a small form factor. Such cameras are expected to be used widely in defense, security and commercial markets. The presentation will highlight recent 3-D integration technology demonstrations at RTI that employ low temperature metal and polymer bonding. We have demonstrated 99.99% operability in large arrays of 3-D interconnects with pitches down to 10 ?m.
