• Conference Proceeding

Issues with fine pitch bumping and assembly

Citation

Nangalia, S., Deane, P., Bonfede, S., Huffman, A., Statler, C., & Rinne, C. (2000). Issues with fine pitch bumping and assembly. In Proceedings of the International Symposium on Advanced Packaging Materials Processes, Properties and Interfaces, pp. 118–23. .

Abstract