The impact of film thickness and substrate surface roughness on the thermal resistance of aluminum nitride nucleation layers
Thickness dependent thermal conductivity measurements were made on aluminum nitride (AlN) thin films grown by two methods on the (0001) surfaces of silicon carbide (SiC) and sapphire substrates with differing surface roughness. We find that the AlN itself makes a small contribution to the overall thermal resistance. Instead, the thermal boundary resistance (TBR) of 5.1 +/- 2.8 m(2)K/GW between the AlN and substrate is equivalent to 240 nm of highly dislocated AlN or 1450 nm of single crystal AlN. An order-of-magnitude larger TBR was measured between AlN films and SiC substrates with increased surface roughness (1.2 nm vs. 0.2 nm RMS). Atomic resolution TEM images reveal near-interface planar defects in the AlN films grown on the rough SiC that we hypothesize are the source of increased TBR. (C) 2013 AIP Publishing LLC.
Su, Z., Freedman, J. P., Leach, J. H., Preble, E. A., Davis, R. F., & Malen, J. A. (2013). The impact of film thickness and substrate surface roughness on the thermal resistance of aluminum nitride nucleation layers. Journal of Applied Physics, 113(21), . https://doi.org/10.1063/1.4808238