• Journal Article

High heat flux, high temperature cooling of electronics with thermoelectric devices

Citation

Bulman, G., Thomas, P. M., Krueger, G., Venkatasubramanian, R., Marckx, D. A., & Ratliff, B. (2014). High heat flux, high temperature cooling of electronics with thermoelectric devices. IEEE Electron Device Letters, 35(4), 476-478. DOI: 10.1109/LED.2014.2305622

Abstract

Single couple PbTe/TAGS-85 and thin-film superlattice Bi2Te3-based thermoelectric couples operated in a downhill active cooling mode, where the cold side temperature (Tc) is above that of the heat sink (Th), are shown to be able to pump heat loads of 204 W/cm2 (Tc ~ 300°C) and 329 W/cm2 (Tc ~ 150°C), respectively, using a 25 °C heat sink temperature. Such TE devices would be useful in active cooling of wide bandgap RF electronics operating ~ 300°C and ~ 150°C, respectively.