• Patent

Electronic package with three-dimensional conductive planes, and methods for fabrication

An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.

Citation

Vic, E., & Temple, D. (2018). Electronic package with three-dimensional conductive planes, and methods for fabrication (Patent No. 9,881,905.)