Electronic package with three-dimensional conductive planes, and methods for fabrication

Vick, E. P., & Temple, D. (2018). Electronic package with three-dimensional conductive planes, and methods for fabrication. (U.S. Patent No. 9,881,905). http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=9,881,905.PN.&OS=PN/9,881,905&RS=PN/9,881,905

Abstract

An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.

Download/Explore

Publications Info

To contact an RTI author, request a report, or for additional information about publications by our experts, send us your request.

Recent Publications

Article

What's in a name? A data-driven method to identify optimal psychotherapy classifications to advance treatment research on co-occurring PTSD and substance use disorders
Article

Grandi Byen-supporting child growth and development through integrated, responsive parenting, nutrition and hygiene
Article

Effects of additional context information in prescription drug information sheets on comprehension and risk and efficacy perceptions
Article

"Show Me the Energy Costs"