An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.
Electronic package with three-dimensional conductive planes, and methods for fabrication
Vick, E. P., & Temple, D. (2018). Electronic package with three-dimensional conductive planes, and methods for fabrication. (U.S. Patent No. 9,881,905). http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=9,881,905.PN.&OS=PN/9,881,905&RS=PN/9,881,905