An electronic package includes an adhesion layer between a first substrate and a second substrate. The adhesion layer is patterned to define openings aligned with through-substrate interconnects and corresponding bond pads. A conductive plane is formed between the first substrate and the second substrate, adjacent to the adhesion layer.
Electronic package with three-dimensional conductive planes, and methods for fabrication
Vic, E., & Temple, D. (2018). Electronic package with three-dimensional conductive planes, and methods for fabrication. (Patent No. 9,881,905).
Abstract
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