RTI uses cookies to offer you the best experience online. By and clicking “accept” on this website, you opt in and you agree to the use of cookies. If you would like to know more about how RTI uses cookies and how to manage them please view our Privacy Policy here. You can “opt out” or change your mind by visiting: http://optout.aboutads.info/. Click “accept” to agree.

Accept

Comparison of temporary wafer bonding process flows

Lueck, M. (2014). Comparison of temporary wafer bonding process flows. In Handbook of 3D Integration. Vol 3: 3D Process Technology (pp. 185 - 189). Wiley.

Publications Info

To contact an RTI author, request a report, or for additional information about publications by our experts, send us your request.

Recent Publications

Article

The evolution of minimally invasive tissue sampling in postmortem examination
Article

Accountability for SRHR in the context of the COVID-19 pandemic
Article

Validation of simple dichotomous self-report on prenatal alcohol and other drug use in women attending midwife obstetric units in the Cape Metropole, South Africa
Article

Model and approach for assessing implementation context and fidelity in the HEALing Communities Study