You are here

Comparison of temporary wafer bonding process flows

Lueck, M. (2014). Comparison of temporary wafer bonding process flows. In Handbook of 3D Integration. Vol 3: 3D Process Technology (pp. 185 - 189). Wiley.

Publications Info

To contact an RTI author, request a report, or for additional information about publications by our experts, send us your request.

Recent Publications

Article

Nanoparticle technology for respiratory tract mucosal vaccine delivery
Article

Consequential effects of increased use of recycled fiber in the United States pulp and paper industry
Article

A housing mobility program's impacts on teen and young adult parenting
Article

Smoking cessation behaviors among older U.S. adults

RTI uses cookies to offer you the best experience online. By continuing to use our website, you agree to the use of cookies. If you would like to know more about cookies and how to manage them please view our Privacy Policy. Learn More.

Got it!