RTI International processing innovative chip packaging technology – Quilt Packaging

RESEARCH TRIANGLE PARK, N.C. – RTI International has partnered with Indiana Integrated Circuits, LLC (IIC) to provide processing for an innovative chip packaging technology known as Quilt Packaging® in silicon based devices.

Quilt Packaging technology, developed by IIC, allows devices made of dissimilar materials or technologies (i.e. analog and digital) to be tiled together like panelsin a quilt. The technology promises to increase electronic system performance while reducing cost, size, weight and power consumption.

RTI will process and integrate chips with this technology for next-generation defense, mobile and consumer applications.

“The trend in the electronics industry is to try to make technology smaller yet more powerful, which requires increasingly higher levels of chip integration and packaging” said John Lannon, Ph.D., director of microsystem integration and packaging at RTI. “IIC’s Quilt Packaging technology provides another innovative solution for reducing interconnect lengths between chips, which in turn enhances microsystem performance and reduces power requirements. We are excited to be partnering with them.”

This novel technology enables integration of multiple chips at their edges, with extremely wide bandwidth performance, sub-micron chip-to-chip alignment accuracy, and a spacing of less than 10 microns between chips, providing another avenue for delivering the demanding performance and power, requirements of today’s electronic systems.
IIC is also pursuing quilt packaging solutions involving heterogeneous integration of dissimilar materials.

“Our next step is to leverage RTI’s advanced through-Si via (TSV) capabilities and combine them with semiconductors other than silicon to assemble and qualify heterogeneous test vehicles, providing customers with the flexibility to choose their optimal multichip configuration, regardless of material or process technology,” said Jason Kulick, President of IIC.

RTI’s Electronics and Applied Physics Division works with commercial, government, and academic clients to develop and implement new or advanced technologies into leading edge applications. RTI’s fully integrated microfabrication and analytical facilities support a diverse base of technology projects with process development, demonstrations and prototyping, and small-volume production.

 

Highlights

  • RTI partnered with Indiana Integrated Circuits, LLC (IIC) to provide processing for an innovative chip packaging technology known as Quilt Packaging® in silicon based devices
  • The technology promises to increase electronic system performance while reducing cost, size, weight and power consumption
  • RTI will process and integrate chips with this technology for next-generation defense, mobile and consumer applications.