Packaging with 3-D architectures

Research Triangle Institute's 3-D Architectures for Semiconductor Integration and Packaging Conference, or 3D ASIP (as it has become known) normally finishes off the "3D conference circuit" for the year and is a good gauge of how far things have progressed in the last 12 months. At the 7th 3D ASIP in Burlingame CA, there were several announcements, statements and rumors having significant impact on the 2.5/3D community.