Vias-last process technology for thick 2.5D Si interposers

Vick, E., Goodwin, S., Cunningham, G., & Temple, D. (2012). Vias-last process technology for thick 2.5D Si interposers. In 2011 IEEE International 3D Systems Integration Conference (3DIC 2011), Osaka, Japan, 31 January – 2 February 2012 (Postponed from October 2011), (pp. 263-266)