• Conference Proceeding

Ultra-Wide Bandwidth/Extremely Low-Loss InP-to-Si-Based Chip/Packaging Characterization from DC-220 GHz.

Citation

Kulick, J., Sizemore, G. M., Ortega, C., Fay, P., Lannon, J. M., & Anderson, R. B. (2015). Ultra-Wide Bandwidth/Extremely Low-Loss InP-to-Si-Based Chip/Packaging Characterization from DC-220 GHz.. In GOMACTech-15 Proceedings, pp. 559–562. .

Abstract