• Journal Article

Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10um for infrared focal plane array applications

Citation

Temple, D., Lueck, M., Malta, D., & Vick, E. (2015). Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10um for infrared focal plane array applications. Japanese Journal of Applied Physics, 54, 030202-1 - 030202-7.

Abstract