RDL: an integral part of today's advanced packaging technologies
EXECUTIVE OVERVIEW Redistribution technology was developed out of necessity to allow fan-in area array packaging (bumping) to take hold when very few chips were being designed for area array. In the intervening years it has been instrumental in developing many of the newer packaging technologies such as wafer-level packaging (WLP), fan-out packaging, and TSV-based interposers and chip stacks
Garrou, P., & Huffman, C. (2011). RDL: an integral part of today's advanced packaging technologies. Solid State Technology, 54(5), 18-20.