• Journal Article

High Density Large Area Array Interconnects Formed by Low Temperature Cu/Sn-Cu Bonding for 3-D Integrated Circuits

Citation

Lueck, M., Reed, J., Gregory, C., Huffman, A., Lannon, J., & Temple, D. (2012). High Density Large Area Array Interconnects Formed by Low Temperature Cu/Sn-Cu Bonding for 3-D Integrated Circuits. IEEE Transactions on Electron Devices, 59(7), 1941 - 1947.

Abstract