• Presentation

High Density Cu-Cu intercconnect bonding for 3-D integration

Citation

Lannon, J., Gregory, C., Huffman, A., Lueck, M., & Temple, D. (2009, May). High Density Cu-Cu intercconnect bonding for 3-D integration. Presented at 59th Electronic Component and Technology Conference, ECTC 2009, San Diego, CA, May, .

Abstract