• Article

High density 3-D integration technology for massively parallel signal processing in advanced infrared focal plane array sensors

The paper describes a platform technology for three-dimensional (3-D) integration of multiple layers of silicon integrated circuits. The technology promises to dramatically enhance on-chip signal processing capabilities of a variety of sensor and actuator devices hybridized with Si electronics. Among these applications are high performance infrared focal plane array detectors

Citation

Temple, D., Bower, C., Malta, D., Robinson, JE., Coffman, PR., Skokan, MR., & Welch, TB. (2006). High density 3-D integration technology for massively parallel signal processing in advanced infrared focal plane array sensors. Proceedings of the IEEE, 1-4. DOI: 10.1109/IEDM.2006.346980