The paper describes a platform technology for three-dimensional (3-D) integration of multiple layers of silicon integrated circuits. The technology promises to dramatically enhance on-chip signal processing capabilities of a variety of sensor and actuator devices hybridized with Si electronics. Among these applications are high performance infrared focal plane array detectors
High density 3-D integration technology for massively parallel signal processing in advanced infrared focal plane array sensors
Temple, D., Bower, C., Malta, D., Robinson, JE., Coffman, PR., Skokan, MR., & Welch, TB. (2006). High density 3-D integration technology for massively parallel signal processing in advanced infrared focal plane array sensors. Proceedings of the IEEE, 1-4. https://doi.org/10.1109/IEDM.2006.346980
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