High density 3-D integration technology for massively parallel signal processing in advanced infrared focal plane array sensors
Temple, D., Bower, C. A., Malta, D., Robinson, J. E., Coffman, P. R., Skokan, M. R., & Welch, T. B. (2006). High density 3-D integration technology for massively parallel signal processing in advanced infrared focal plane array sensors. In International Electron Devices Meeting, 2006. IEDM '06. San Francisco, CA. 11-13 Dec 2006, pp. 1–4. San Francisco, CA: .
The paper describes a platform technology for three-dimensional (3-D) integration of multiple layers of silicon integrated circuits. The technology promises to dramatically enhance on-chip signal processing capabilities of a variety of sensor and actuator devices hybridized with Si electronics. Among these applications are high performance infrared focal plane array detectors