• Presentation

High density 3-D integration of application specific silicon integrated circuits in high performance infrared imaging sensors

Citation

Temple, D., Robinson, J. E., & Williams, C. K. (2007, October). High density 3-D integration of application specific silicon integrated circuits in high performance infrared imaging sensors. Presented at 4th International 3-D Architectures for Semiconductor Integration and Packaging Conference, Birmingham, CA, October, .

Abstract