• Presentation

Fabrication, assembly, and evaluation of sub-10um diameter Cu/Sn and solder bump bond arrays

Citation

Huffman, A., Lueck, M., Lannon, J., Gregory, C., Sepp, B., & Temple, D. (2009, November). Fabrication, assembly, and evaluation of sub-10um diameter Cu/Sn and solder bump bond arrays. Presented at IMAPS 2008 41st International Symposium on Microelectronics, Providence, RI, November, .

Abstract