• Presentation

Fabrication, assembly, and evaluation of Cu/Sn-Cu and Cu-Cu Bump bonding arrays for ultra-fine pitch hybridization and 3-D integration

Citation

Huffman, A., Lueck, M., Lannon, J., Gregory, C., & Temple, D. (2008, September). Fabrication, assembly, and evaluation of Cu/Sn-Cu and Cu-Cu Bump bonding arrays for ultra-fine pitch hybridization and 3-D integration. Presented at PIXEL 2008 International Workshop, Batavia, IL, September, .

Abstract