• Presentation

Fabrication and testing of thin silicon interposers with multilevel frontside and backside metallization and Cu-filled TSVs

Citation

Malta, D., Lueck, M., Huffman, A., Gregory, C., Butler, M., Lannon, J., & Temple, D. S. (2013, May). Fabrication and testing of thin silicon interposers with multilevel frontside and backside metallization and Cu-filled TSVs. Presented at 63rd Electronic Components and Technology Conference (ECTC 2013), Las Vegas, NV, May 28-31, .

Abstract