• Journal Article

Enabling more capability within smaller pixels: advanced wafer-level process technologies for integration of focal plane arrays with readout electronics (invited paper)

Citation

Temple, D., Vick, E., Lueck, M., Malta, D., Skokan, M., Masterjohn, C., & Muzilla, M. (2014). Enabling more capability within smaller pixels: advanced wafer-level process technologies for integration of focal plane arrays with readout electronics (invited paper). Proceedings of SPIE, 9100, 91000L1 - 9100L7.

Abstract