• Journal Article

Bridging the Interconnection Density Gap for Exascale Computation

Citation

Stevenson, D. S., & Conn, R. O. (2011). Bridging the Interconnection Density Gap for Exascale Computation. Computer, 44(1), 49-57. DOI: 10.1109/MC.2011.8

Abstract

Three-dimensional silicon interposers are the basis for an architectural approach that bridges the interconnection density between FR-4 printed circuit boards and silicon ICs. The promise is increased performance and less complexity relative to monolithic silicon-based designs