• Article

Bridging the Interconnection Density Gap for Exascale Computation

Three-dimensional silicon interposers are the basis for an architectural approach that bridges the interconnection density between FR-4 printed circuit boards and silicon ICs. The promise is increased performance and less complexity relative to monolithic silicon-based designs

Citation

Stevenson, DS., & Conn, RO. (2011). Bridging the Interconnection Density Gap for Exascale Computation. Computer, 44(1), 49-57. https://doi.org/10.1109/MC.2011.8

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