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Article

Deep neural networks and transfer learning for food crop identification in UAV images

February 25, 2020
Article

The use of Sentinel-1 and -2 data for monitoring maize production in Rwanda

October 21, 2019
The view from above
Research Brief

The view from above

August 15, 2019
Patent

Flexible electronic assemblies with embedded electronic devices and methods for their fabrication

April 15, 2019
Patent

Detection of corrosion using dispersed embedded sensors

February 18, 2019
Unmanned aircraft systems can improve survey data collection
Research Brief

Unmanned aircraft systems can improve survey data collection

June 05, 2018
Article

ROIC for 3 μm pixel pitch colloidal quantum dot detectors

May 13, 2018
Article

High-efficiency thin-film superlattice thermoelectric cooler modules enabled by low resistivity contacts

February 28, 2018
Patent

Electronic package with three-dimensional conductive planes, and methods for fabrication

January 29, 2018
Article

Advanced thermal management of high-power quantum cascade laser arrays for infrared countermeasures

October 04, 2017
Article

Wafer-level vacuum packaging of smart sensors

October 31, 2016
Patent

Electronic Devices Utilizing Contact Pads with Protrusions and Methods for Fabrication

February 08, 2016
Patent

Three dimensional interconnect structure and method thereof

March 09, 2015
Article

Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10 µm for infrared focal plane array applications

February 28, 2015
Article

Advances in three-dimensional integration technologies in support

January 31, 2015
Article

Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10um for infrared focal plane array applications

December 31, 2014
Patent

Faraday cup array integrated with a readout IC and method for manufacture thereof

October 20, 2014
Article

Enabling more capability within smaller pixels

April 30, 2014
Article

Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization

December 31, 2013
Patent

Die bonding utilizing a patterned adhesion layer

January 28, 2013
Article

High Density Large Area Array Interconnects Formed by Low Temperature Cu/Sn-Cu Bonding for 3-D Integrated Circuits

June 30, 2012
Article

High Performance Solenoidal Radio Frequency Transformers on High Resistivity Silicon Substrates for 3D Integrated Circuits

June 30, 2012
Article

High-performance solenoidal RF transformers on high-resistivity silicon substrates for 3D integrated circuits

June 30, 2012
Article

High-density large-area-array interconnects formed by low-temperature Cu/Sn–Cu bonding for three-dimensional integrated circuits

March 31, 2012
Article

Planar PbS quantum dot/C-60 heterojunction photovoltaic devices with 5.2% power conversion efficiency

March 31, 2012

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