Search results related to Dorota Temple

Showing results 1-25 of 72.

Article

High Performance Solenoidal Radio Frequency Transformers on High Resistivity Silicon Substrates for 3D Integrated Circuits

July 2012
Article

Highly flexible transparent electrodes for organic light-emitting diode-based displays

October 2004
Article

Bonding for 3-D integration of heterogeneous technologies and materials

October 2008
Article

Superfilling technology: Transferring knowledge to industry from the National Institute of Standards and Technology

February 2011
Article

Method for evaluating mechanical performance of thin film barriers for flexible displays

April 2007
Article

Superfilling Technology: Transferring Knowledge to Industry from the National Institute of Standards and Technology

February 2011
Article

Macroelectronics: Perspectives on technology and applications

July 2005
Article

Development and evaluation of bend-testing techniques for flexible-display applications

July 2005
Article

Evidence of spin-wave demagnetization in Fe-Cr giant magentoresistance multilayers

January 2005
Article

Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10um for infrared focal plane array applications

January 2015
Article

Scaling law and its universality in the anomalous Hall effect of giant-magnetoresistive Fe/Cr multilayers

March 2006
Article

A method to evaluate mechanical performance of thin transparent films for flexible displays

April 2007
Article

Advanced Processing Techniques for Through-wafer Interconnects

January 2004
Article

Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration

March 2009
Article

Planar PbS quantum dot/C-60 heterojunction photovoltaic devices with 5.2% power conversion efficiency

April 2012
Article

Extending acoustic microscopy for comprehensive failure analysis applications

October 2011
Article

Big and bendable

September 2005
Article

High density metal-metal interconnect bonding for 3D integration

January 2012
Article

The key to low temperature bonding for 3D integration

September 2011
Article

Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization

January 2014
Article

High-density large-area-array interconnects formed by low-temperature Cu/Sn–Cu bonding for three-dimensional integrated circuits

April 2012
Article

High Density Large Area Array Interconnects Formed by Low Temperature Cu/Sn-Cu Bonding for 3-D Integrated Circuits

July 2012
Article

Role of heterostructures and multiple magnetic phases in the low-field magnetization of Fe-Cr giant magnetoresistive multilayers

December 2006
Article

Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10 µm for infrared focal plane array applications

March 2015
Article

High-performance solenoidal RF transformers on high-resistivity silicon substrates for 3D integrated circuits

July 2012

RTI uses cookies to offer you the best experience online. By continuing to use our website, you agree to the use of cookies. If you would like to know more about cookies and how to manage them please view our Privacy Policy. Learn More.

Got it!