Publications Related to "Dorota Temple"


Wafer-Level Vacuum Packaging of Smart Sensors

The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors "low cost" for ubiquitous presence, and "smart" for connectivity and autonomy. By using wafer-level processes not only for the smart sensor...


Three dimensional interconnect structure and method thereof

A three-dimensional interconnect includes a first substrate bonded to a second substrate, the first substrate including a device layer and a bulk semiconductor layer, a metal pad disposed on the second substrate, an electrically insulating layer...


Advances in three-dimensional integration technologies in support

Staring infrared focal plane arrays (FPAs) require pixel-level, three-dimensional (3D) integration with silicon readout integrated circuits (ROICs) that provide detector bias, integrate detector current, and may further process the signals. There...


Enabling more capability within smaller pixels

Over the past decade, the development of infrared focal plane arrays (FPAs) has seen two trends: decreasing of the pixel size and increasing of signal-processing capability at the device level. Enabling more capability within smaller pixels can...