Search results related to Dorota Temple

Showing results 1-25 of 96.

Article

High Performance Solenoidal Radio Frequency Transformers on High Resistivity Silicon Substrates for 3D Integrated Circuits

July 2012
Article

Bonding for 3-D integration of heterogeneous technologies and materials

October 2008
Article

Superfilling technology: Transferring knowledge to industry from the National Institute of Standards and Technology

February 2011
Patent

Faraday cup array integrated with a readout IC and method for manufacture thereof

October 2014
Article

Superfilling Technology: Transferring Knowledge to Industry from the National Institute of Standards and Technology

February 2011
RTI in the Media

RTI International names three new fellows; promotes Dorota Temple

November 08, 2015
- WRAL TechWire
Article

Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10um for infrared focal plane array applications

January 2015
Patent

Three dimensional interconnect structure and method thereof

March 2015
Article

Fabrication and characterization of metal-to-metal interconnect structures for 3-D integration

March 2009
Article

Planar PbS quantum dot/C-60 heterojunction photovoltaic devices with 5.2% power conversion efficiency

April 2012
Article

Extending acoustic microscopy for comprehensive failure analysis applications

October 2011
RTI in the Media

RTI Press names new editors

January 19, 2014
- WRAL Local Tech Wire
Article

High density metal-metal interconnect bonding for 3D integration

January 2012
Article

The key to low temperature bonding for 3D integration

September 2011
Article

Fabrication and Testing of a TSV-Enabled Si Interposer With Cu- and Polymer-Based Multilevel Metallization

January 2014
Article

High-density large-area-array interconnects formed by low-temperature Cu/Sn–Cu bonding for three-dimensional integrated circuits

April 2012
Patent

Electronic Devices Utilizing Contact Pads with Protrusions and Methods for Fabrication

February 2016
Article

High Density Large Area Array Interconnects Formed by Low Temperature Cu/Sn-Cu Bonding for 3-D Integrated Circuits

July 2012
News Release

RTI International’s Press names new leadership

January 19, 2014
Don Bailey speaks at an RTI Fellow Program event
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RTI Fellow Program

Integrating our scientific leadership and business strategy, enhancing the impact of our research, and advancing the state of science
News Release

New Monograph Addresses Need for Energy Behavior Research

July 05, 2011
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News Release

RTI International welcomes three new Fellows, announces new Distinguished Fellow

November 05, 2015
Article

Scaling of three-dimensional interconnect technology incorporating low temperature bonds to pitches of 10 µm for infrared focal plane array applications

March 2015
Patent

Die bonding utilizing a patterned adhesion layer

January 2013
Article

High-performance solenoidal RF transformers on high-resistivity silicon substrates for 3D integrated circuits

July 2012

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