| Title: | Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics |
| Patent No.: | 7523617 |
| Type: | Patent |
| Date: | 2009 |
| Authors: | Venkatasubramanian, R., Alley, R.G., Addepalli, P., Reddy, A.J., Siivola, E.P., O'Quinn, B.C., Coonley, K.D., Posthill, J., Colpitts, T. |
| Abstract: | A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium. |
| Online Resources: | Patent Patent Details (US PTO) |
| Full Citation: | Venkatasubramanian, R., Alley, R.G., Addepalli, P., Reddy, A.J., Siivola, E.P., O'Quinn, B.C., & et al. (2009). Thin film thermoelectric devices for hot-spot thermal management in microprocessors and other electronics. U.S. Patent No. 7,523,617. Washington, D.C.: U.S. Patent and Trademark Office |
