| Title: | Piezoelectric micromachined ultrasonic transducer with air-backed cavities |
| Patent No.: | 7449821 |
| Type: | Patent |
| Date: | 2008 |
| Authors: | Dausch, D.E. |
| Abstract: | A piezoelectric micromachined ultrasonic transducer comprising a
substrate and a first dielectric film formed on the substrate. An
opening having a sidewall is formed through the substrate and first
dielectric film. A bottom electrode is formed on the first
dielectric film spanning the opening. A piezoelectric element is
formed on the bottom electrode. A second dielectric film surrounds
the piezoelectric element. A conformal insulating film is formed on
the sidewall of the opening. A conformal conductive film is formed
in contact with the bottom electrode and on the sidewall of the
opening, wherein an open cavity is maintained in the opening. A top
electrode is formed in contact with the piezoelectric element. |
| Online Resources: | Patent Details (US PTO) |
| Full Citation: | Dausch, D.E. (2008). Piezoelectric micromachined ultrasonic transducer with air-backed cavities. U.S. Patent No. 7,449,821. Washington, D.C.: U.S. Patent and Trademark Office |
