Advanced Technology » Microfabrication Services Page Tools AddThis

Fabrication and Development

AFP Services: IRE Device

RTI International is a leader in the research, development, and prototyping of innovative materials, microstructures, and devices. Our labs are equipped with a wide variety of tools and processing capabilities. Currently, we are focused on the development of numerous materials and electronics technologies, including:

  • Sensors and actuators
  • 3-D interconnect technologies
  • Biomaterials
  • Photonics and optoelectronics
  • Organic light-emitting devices (OLEDs)
  • Micro-electromechanical systems (MEMS) devices
  • Flexible displays and electronics
  • Advanced electronic packaging solutions


RTI specializes in custom fabrication and prototyping services, and our team is ready to assist with your most challenging development projects. Our labs are professionally staffed and managed by highly trained and experienced technical personnel. For additional related information, see Analytical Lab Services.

Fabrication Services Capabilities

Photolithography
Photolithography		  
  • Thin and thick resists (positive and negative)
  • Contact and proximity alignment/exposure
  • Back side alignment
  • 5X reduction stepper
Etching
Etching Monitor		  
  • Wet etching of oxides and metals
  • Anisotropic wet etching of silicon
  • Dry etching of oxides, nitrides, and polymers
  • Ion milling of metal films and stacks
  • High aspect-ratio deep silicon RIE
Thin-film deposition
Sputtering Tool		  
  • Electron beam evaporation of metals
  • DC/RF sputtering of metals & dielectrics
  • PECVD oxides and low stress nitrides
  • MOCVD conformal copper films
Specialty coatings
RTI Technician: Alan Huffman		  
  • Spin-on polymers (polyimides, BCB, PVDF, etc)
  • Parylene organic dielectric films
  • Plated metals
  • Molecular vapor deposition (self-assembled monolayers) 

Thermal processing
Thermal Processing Oven

  
  • Bakes and cures for resists and polymers
  • High-temperature furnace anneals
Inspection & metrology
Inspection Metrology		  
  • Optical microscopy
  • 4-pt resistivity mapping
  • Ellipsometry and reflectometry
  • Film stress measurements
  • Profilometry
  • White light interferometry
Back-end processing
Solder Bump		  
  • Solder bumping
  • Flip chip alignment and bonding
  • Packaging and assembly
Testing capabilities
Probe Station		  
  • I-V and C-V measurements
  • Optical characterization
  • Reliability testing
  • Materials testing

Most of our processes are able to handle a variety of wafer materials and sizes (up to 8 inches). We can usually accommodate small samples and special substrate geometries. To learn more about our advanced packaging and interconnect technologies, see 3-D Integration and Electronic Packaging.


Contact us for more information

Related Content