Electronic Packaging and Assembly
As an extension of our work in the analysis and fabrication of novel materials, RTI researches and develops innovative solutions in electronic packaging and assembly. Our technical staff work directly with clients to help them meet a variety of requirements, some of which include the following:
- Ultra fine-pitch flip chip bumping
- Fine-pitch flip chip assembly
- Fluxless soldering and assembly using plasma-assisted dry soldering (PADS) technology
- Microelectromechanical systems (MEMS) packaging
- Reliability testing
For more information, see 3-D Integration and Electronic Packaging.
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